1 ?2009 littelfuse, inc. spa? silicon protection array products specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 12pf emi filter array with esd protection SP6001 lead-free/green series lead-free/green SP6001 description applications the littelfuse SP6001 spa series integrates 4 and 6 emi flters (c-r-c) into a small, low-profle udfn package with each flter providing greater than -30db attenuation at 1ghz. additionally, each i/o is capable of shunting 30kv esd strikes (iec61000-4-2, contact discharge) away from sensitive electronic components. the performance of this small, slim design makes it extremely suitable for mobile handsets, pdas and notebook computers. SP6001 lead-free/green series rohs pb green features ? emi fltering of frequencies from 800mhz to 3ghz ? greater than -30db attenuation (typ) at 1ghz ? esd, iec61000-4-2, 30kv contact, 30kv air ? small, low-profle udfn package (typ 0.5mm height) ? keypad interface for portable electronics ? lcd and camera display interfaces for handsets ? connector interfaces for portable electronics ? mobile phone ? smartphone ? portable navigation device pinout 5 8 1 4 1 6 7 12 gnd gnd sp60 01 -04utg-1 sp60 01 -06utg-1 udfn-08 udfn-1 2 functional block diagram cd cd 1 8 cd cd 2 7 cd cd 3 6 cd cd 4 5 cd cd 1 12 cd cd 2 11 cd cd 3 10 cd cd 4 9 cd cd 5 8 cd cd 6 7 sp60 01-04utg-1 sp60 01-06utg-1 hf
2 ?2009 littelfuse, inc. specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products 12pf emi filter array with esd protection SP6001 lead-free/green series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 6.0 v breakdown voltage v br i r =1ma 7.0 7.5 8.0 v reverse leakage current i leak v rwm =5v 0.1 1.0 a resistance r a i r =10ma 85 100 115 diode capacitance 1,2 c d v r =2.5v,f=1mhz 12 pf line capacitance 1,2 c l v r =2.5v,f=1mhz 19 24 29 pf esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv cutoff frequency 3 f -3db above this frequency, appreciable attenutation occurs 115 mhz notes: 1 parameter is guaranteed by design and/or device characterization. 2 total line capacitance is two times the diode capacitance (c d ). 3 50 source and 50 load termination
3 ?2009 littelfuse, inc. spa? silicon protection array products specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 12pf emi filter array with esd protection SP6001 lead-free/green series lead-free/green SP6001 analog crosstalk (s41) insertion loss (s21) line capacitance vs. dc bias 3. 000 00 0mhz stop 6 00 0. 00 0. 00 0mhz x2 star t 21 log ma g5 db/ ref 0 db 1 _:-5.8807 db ch1 s cor smo 1 0 10 20 30 40 50 dc bias (v) capacitance (pf) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 st ar t 3. 000 000 mhz stop 6 00 0. 000 00 0 mhz x2 ch1 s log ma g1 0 db/ ref 0 db smo cor del 1
4 ?2009 littelfuse, inc. specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products 12pf emi filter array with esd protection SP6001 lead-free/green series application example refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters dx: SP6001-04 silicon protection array signa l ground outside world SP6001-04utg (dfn) lcd module controller d1 d2 d3 d4 input 1 4 gnd 8 5
5 ?2009 littelfuse, inc. spa? silicon protection array products specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 12pf emi filter array with esd protection SP6001 lead-free/green series lead-free/green SP6001 package dimensions - udfn-08 symbol udfn-08 millimeters inches min max min max a 0.450 0.550 0.018 0.022 a1 0.000 0.050 0.000 0.002 a3 0.127 ref 0.005 ref b 0.150 0.250 0.006 0.010 d 1.600 1.800 0.063 0.071 d2 1.100 1.300 0.043 0.051 e 1.250 1.450 0.049 0.057 e2 0.300 0.500 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.200 0.008 0.000 l 0.150 0.350 0.006 0.014 d e a a1 a3 d2 e2 l k b e package dimensions - udfn-12 symbol udfn-12 millimeters inches min max min max a 0.450 0.550 0.018 0.022 a1 0.000 0.050 0.000 0.002 a3 0.127 ref 0.005 ref b 0.150 0.250 0.006 0.010 d 2.400 2.600 0.094 0.102 d2 1.900 2.100 0.075 0.083 e 1.250 1.450 0.049 0.057 e2 0.300 0.500 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.200 0.008 0.000 l 0.150 0.350 0.006 0.014 d e a a1 a3 d2 e2 l k b e
6 ?2009 littelfuse, inc. specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products 12pf emi filter array with esd protection SP6001 lead-free/green series embossed carrier tape & reel specifcation C udfn-08 p2 d e f t w bo ko ao p d1 ordering information part number package size marking min. order qty. SP6001-04utg-1 udfn-08 1.7x1.35mm jh4 3000 SP6001-06utg-1 udfn-12 2.5x1.35mm jh6 3000 product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13. part numbering system part marking system sp 6001 0x u t g -1 silicon protection array series package udfn-08 (1.7x1.35mm) udfn-12 (2.5x1.35mm) t= tape & reel g= green number of channels 04 = 4 channel udfn-08 06 = 6 channel udfn-12 ? jh4 jh6 j h x product series j = SP6001 assembly site 4 = udfn-08 6 = udfn-12 symbol millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 1.00 - 0.040 - d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.70 8.30 0.303 0.327 p2 1.95 2.05 0.077 0.081 a0 1.55 1.75 0.061 0.069 b0 1.90 2.1 0.075 0.083 k0 0.95 1.15 0.037 0.045 t 0.30 max 0.012 max
7 ?2009 littelfuse, inc. spa? silicon protection array products specifcations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 12pf emi filter array with esd protection SP6001 lead-free/green series lead-free/green SP6001 embossed carrier tape & reel specifcation C udfn-12 symbol millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 0.55 0.65 0.021 0.025 d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.90 8.30 0.311 0.327 p2 1.95 2.05 0.077 0.081 a0 1.33 1.53 0.052 0.060 b0 2.63 2.83 0.103 0.111 k0 0.58 0.78 0.023 0.031 t 0.22 max 0.009 max p2 t bo e f w od / od / p k0 a0
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